全自動龍門式滾鍍生產(chǎn)線

全自動龍門式滾鍍生產(chǎn)線

※特性說明：

·此電鍍生產(chǎn)線可全自動、半自動轉(zhuǎn)換，設(shè)計科學(xué)合理、

    緊湊，自動化程度高；

·采用人機界面觸摸屏式控制管理，并可對數(shù)據(jù)，PH

    時間，運行情況等進行有效監(jiān)控；

·主要電器采用日本三菱、歐姆龍、施耐德等品牌；

·設(shè)備廣泛用于五金、電子、ABS塑膠、汽車、燈飾家

具等行業(yè)。

       電鍍設(shè)備介紹:滾鍍早在20世紀(jì)20年代就已經(jīng)在工業(yè)上得于應(yīng)用，中國的滾鍍最早于20世紀(jì)50年代后期出現(xiàn)在上海。現(xiàn)中國滾鍍的產(chǎn)量約

占整個電鍍加工的50%,并涉及到鍍鋅、銅、鎳、鉻、金、銀及合金等幾十個鍍種。

       常規(guī)滾鍍流程：將經(jīng)過鍍前處理的小零件裝進滾筒內(nèi)，零件靠自身的重力作用將滾筒內(nèi)的陰極導(dǎo)電裝置緊緊壓住，以保證零件

受鍍時所需的電流能順利地傳輸。然后，滾筒以一定的速度按一定的方向旋轉(zhuǎn)，零件在滾筒內(nèi)受到旋轉(zhuǎn)作用后不停地翻滾、跌落。同

時，主要金屬離子受到電場作用后在零件表面還原為金屬鍍層，滾筒外新鮮溶液連續(xù)不斷地通過滾筒壁板上無數(shù)的小孔補充到滾筒內(nèi)，

而滾筒內(nèi)的舊液及電鍍過程中產(chǎn)生的氫氣也通過這些小孔排出筒外。

        因此，滾筒的結(jié)構(gòu)、尺寸、大小、轉(zhuǎn)速、導(dǎo)電方式及開孔的孔徑、開孔的密度等因素，必將會與滾鍍的生產(chǎn)效率、鍍層質(zhì)量有

重要的關(guān)聯(lián)性，德爾福的設(shè)計工程師非常注重以上數(shù)據(jù)的準(zhǔn)確性及科學(xué)性，以提升滾鍍加工的至高品質(zhì)。

        為幫助廣大客戶有效降低人力成本，GUANGTAI的工程研發(fā)設(shè)計部強力向新老客戶推薦以下先進機構(gòu)：

※DESCRTPTION AND FEATURES:

·Automatic/Manual mode can be exchanged. According to

   different products and process requirements, can be configured 

   modified on the plating line.

·Under Human-Computer interface control, It's can easily

    operate and manage, display the database, PH time and

    monitor the running of  the equipment.

·Main electrical components use"Mitsubishi","Schneider",

    "Omron"brand products to ensure the stability of electrical.

·This type of plating line are applied for hardware, electronic,

    ABS plastic, cars, decorative lights, furniture industry and so on.

As early as in 1920s,barrel plating was used in industry. The barrel plating of China appeared in Shanghai earliest in late 1950s. Now the

output of barrel plating of China covers nearly 50% in the whole plating processing, and it is involved with several decades of plating categories

including zinc, copper, nickel, chrome, gold, silver and alloy plating, etc.

       Conventional flow of barrel plating: put sm all parts after before-plating treatment into the drive drum, and parts firmly press the cathode

electric devices inside the drive drum by virtue of their weight so as to ensure that current can be smoothly transmitted while plating of parts.

Then the drive drum rotates at certain speed and direction. Parts continually rolls and falls inside the drive drum under rotation action. At the same

time, main metallic ions are reduced into metallic plating film on the surface of parts under action of electric field. The fresh solution outside the

drive drum continually supplements into the drive drum by many small holes on the wall of drive drum, and the used solution inside the drive drum

and hydrogen generated in the course of plating are also released through these small holes. Therefore, the structure, size, rotat

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