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特征:
1. 皮秒激光設備同納秒激光設備相比，相對的熱影響區域大大減小，更有利于精密加工。
2. 加工表面更加光滑。
3. 除了電路板加工以外，皮秒設備也可以加工陶瓷，硅片，鐵氟龍等材料
Features:
1. Compared to nano laser equipment, pico laser significantly reduces the heat effected area, which is better for precision processing.
2. The processing surface is smoother.
3. Apart from PCB processing, pico equipment can also be used in ceramic, silicon, teflon, etc.
規格 Specification：
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項目 Item |
規格 Specification |
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激光類型 Laser Type |
UV Pico Laser / 255nm |
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平均輸出功率 Avg. Output Power |
>15w@200 KHz |
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掃描范圍和方法 Scan Scope & Method |
Advanced 2D on the fly |
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X-Y平臺 X-Y stage |
分開的平臺，無芯線性驅動 Split Stage, Coreless Linear Motor |
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面板尺寸 Panel Size |
650mm X 650mm |
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切割精度 Cutting Precision |
±10μm @avg |
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裝載機 Loader/Un-Loader |
附加選項（片對片 & 卷對卷） Additional Option (Sheet to Sheet & Roll to Roll |
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電力供應 Power Supply |
220V, 3-phase, 50/60 Hz |
加工效果 Effects:
