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| 顏色：透明 | 基材：pet/po | 厚度：0.17（mm） |
| 延伸系數：100% | 短期耐溫性：NA（℃） | 加工定制：是 |
| 寬度：180/210/230/300/330（mm） | 膠系：亞克力 | 長期耐溫性：NA（℃） |
| 型號：BK-78315 | 適用范圍：玻璃切割 晶圓切割 | 品牌：LINTEC |
我公司專業代理琳得科ADWILL D系列UV膜，用于玻璃，晶圓，基板，陶瓷片等產品的切割。產品線齊全，價格優勢，歡迎來電咨詢。
Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.
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Si Wafer |
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Glass / Ceramics |
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Package Substrate |
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Stealth Dicing |
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Wafer with LC Tape |
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Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.
ount tape Adwill D-series specification
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Name of tape |
D-105V |
D-203 |
D-210 |
D-218 |
D-410T |
D-510T |
D-511T |
D-628 |
D-636 |
D-636 (LM001B) |
D-650 |
D-667 |
D-670 |
D-675 |
D-820 |
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Tape thickness (um) |
90 |
65 |
125 |
203 |
130 |
170 |
170 |
90 |
155 |
95 |
90 |
90 |
90 |
90 |
110 |
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Face material / Thickness (um) |
PVC / 80 |
PET / 50 |
PET / 100 |
PET / 188 |
PO / 100 |
PO / 140 |
PO / 140 |
PO / 80 |
PO / 140 |
PO / 80 |
PO / 80 |
PO / 80 |
PO / 80 |
PO / 80 |
PVC / 100 |
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Color |
Blue |
Transparent |
Transparent |
Transparent |
Clear |
Clear |
Clear |
Clear |
Clear |
Clear |
Clear |
Transparency |
Clear |
Clear |
Blue |
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Adhesive layer / Thickness (um) |
Acrylic / 10 |
Acrylic / 15 |
Acrylic / 25 |
Acrylic / 15 |
Acrylic / 30 |
Acrylic / 30 |
Acrylic / 30 |
Acrylic / 10 |
Acrylic / 15 |
Acrylic / 15 |
Acrylic / 10 |
Acrylic / 10 |
Acrylic / 10 |
Acrylic / 10 |
Acrylic / 10 |
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Before UV adhesion (g/inch) |
400 |
2000 |
2000 |
1600 |
2000 |
2300 |
1200 |
1000 |
1400 |
1200 |
350 |
400 |
400 |
200 |
340 |
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After UV adhesion (g/inch) |
35 |
15 |
20 |
25 |
70 |
80 |
30 |
10 |
65 |
100 |
10 |
60 |
60 |
20 |
75 |
|
Holding power (sec.) |
10000 |
3000 |
50000 |
3000 |
50000 |
50000 |
>70000 |
>70000 |
50000 |
50000 |
>70000 |
>70000 |
>70000 |
>70000 |
>70000 |
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25% strength MD (kg/cm) |
0.8 |
6 |
12 |
>15 |
1 |
1.25 |
1.25 |
0.8 |
1.25 |
0.8 |
0.8 |
0.8 |
0.8 |
0.8 |
0.7 |
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25% strength CD (kg/cm) |
0.7 |
6 |
12 |
>15 |
0.9 |
1.2 |
1.2 |
0.7 |
1.2 |
0.7 |
0.7 |
0.7 |
0.7 |
0.7 |
0.6 |
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Tensile strength MD (kg/cm2) |
285 |
1500 |
2000 |
>1000 |
320 |
350 |
350 |
340 |
350 |
320 |
340 |
340 |
340 |
340 |
250 |
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Tensile strength CD (kg/cm2) |
225 |
1500 |
2000 |
>1000 |
260 |
340 |
340 |
280 |
340 |
270 |
280 |
280 |
280 |
280 |
200 |
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Elongation MD (%) |
295 |
120 |
100 |
>50 |
480 |
570 |
570 |
450 |
570 |
450 |
450 |
450 |
450 |
450 |
300 |
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Elongation CD (%) |
285 |
120 |
100 |
>50 |
530 |
620 |
620 |
500 |
620 |
500 |
500 |
500 |
500 |
500 |
200 |
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Expandability |
Excellent |
No good |
No good |
No good |
No good |
No good |
No good |
No good |
No good |
Fair |
No good |
Fair |
Fair |
Good |
Excellent |
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Suitable chip size |
>2X2mm |
>1X1mm |
>1X1mm |
>1X1mm |
>0.5X0.5mm |
>0.5X0.5mm |
>0.5X0.5mm |
>0.5X0.5mm |
>0.5X0.5mm |
>0.5X0.5mm |
>1X1mm |
>1X1mm |
>1X1mm |
>2X2mm |
>2X2mm |
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Guarantee period (Mon.) |
4 |
6 |
6 |
6 |
5 |
5 |
5 |
5 |
5 |
5 |
8 |
5 |
5 |
5 |
2 |
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Remark |
Expandable tape |
For glass & ceramic dicing |
For glass & ceramic dicing |
For glass & ceramic dicing |
For package dicing (CSP, BGA) |
For package dicing (CSP, BGA) |
For package dicing (CSP, BGA) |
For small chip dicing |
For small chip dicing |
For small chip dicing |
For LOC package, Low adhesive residue |
Standard dicing tape |
Standard dicing tape |
Standard dicing tape |
Anti-static dicing tape |
