GNX200BP晶圓研磨/晶圓背拋概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.
GNX200BP晶圓研磨/晶圓背拋規格
Maximum wafer-machining diameter of wafer64” or 8”
Grinding Spindle: Bearing type Air bearing, maximum 3600rpm
Motor 2.2kw,4P,high frequency motor
Rapid feed speed 200mm/min
Grind feed speed 1 to 999 μm/min
Grinding wheel size ?250 mm
Index Table: Number of work spindles 3
Work spindle Bearing type Mechanical Bearing, or Air Bearing (optional)
Speed of Work Spindles 1 to 600 rpm
Automatic Sizing Device:
Wafer thickness measuring system 2 point contact in-process gauge
Wafer minimum setting size 1 μm
Wafer size display range 0to 1.2 mm; extended range software available Table Cleaning Device (Grinder side)Water + Ceramic block
Wafer Cleaning Unit (Grinder side) Water + brush, and spin/rinse dry station
Number of Cassettes 2 stations for each unit (Grinder & Polish unit)
Polish head 3 Kw AC servo motor for 10 – 460 rpm
Oscillation speed 100–8,000 mm/min.
Head Load 50 –999 g//cm2
Pad size 200mm O.D.
Polish table speed 3 Kw AC servo motor for 50 – 200rpm
Vacuum Chuck material Alumina ceramics (dedicate size of wafer)
Chuck cleaning Brush + Water
Wafer cleaning N.C.W + DI water for Polish surface & Air blow spin dry
