TOYO UDV-100J芯片切割uv膜，新友維半導體切割uv膜

產品價格：	電詢/人民幣
最后更新：	2013-06-01 11:46:43
產品產地：	新友維
發貨地：	15377723326 (發貨期：當天內發貨)
供應數量：	不限
有效期：	長期有效
最少起訂：	1
瀏覽次數：	966

公司基本資料信息

東莞市新友維膠粘制品有限公司
王桂云小姐銷售課長
會員[試用會員產品]
郵件1779529894@qq.com
手機15377723326
電話
傳真
地址東莞市長安鎮咸西新工業區富寧街9號

產品詳細說明

晶圓切割膠帶 - Pressure Sensitive Series -

Part Number :
F - 90
T - 80
T - 120
GE - 200

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability

Specification

Recommended Works	Part Number	Base Film	Color	Thickness (μm)	Adhesion Thickness (μm)	Adhesive Strength (N/20mm)	Probe Tack (N/20mm2)	Feature
Si GaAs Other Semiconductor	F-90MW	PO	MW	90	10	1	1	PVC-free type
	T-80MW	PVC		80		0.8	0.7	Excellent temporal stability
	T-80HW			80		1.7	1
	T-120HW			120		1.7	1
Thick Workpiece	20GE-200		LB	200		2.7	2.9	For thick workpiece

＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.

晶圓切割膠帶 - UV Series -

Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.

Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Recommended Work I	Si GaAs Other Semi conductor
Part Number	UDV- 80J	UDV- 100J	UHP- 110B	UHP- 0805MC	UHP- 1005M3	UHP- 110M3
基材	PVC		PO
顏色	T		MW
總厚度 (μm)	80	100	110	85	105	110
黏著力 (μm)	10			5		10
Adhesive Strength (N/20mm)	3.8(0.2)	3.8(0.2)	2.9(0.2)	5.0(0.2)	5.0(0.2)	7.6(0.2)
Probe Tack (N/20mm2)	2.1(0.05)	2.1(0.05)	2.7(0.05)	1.7(0.05)	2.7(0.05)	3.9(0.05)
特性	Easy pickup			For less chipping		For small size chips

Recommended Work II	Package
Part Number	UHP-1025M3	UHP-1510M3	UHP-1525M3	USP-1515M4	USP-1515MG
基材	PO
顏色	MW
總厚度 (μm)	125	160	175	165
黏著力 (μm)	25	10	25	15
Adhesive Strength (N/20mm)	12.0(0.2)	6.5(0.2)	13.5(0.2)	14.5(0.2)	15.0(0.2)
Probe Tack (N/20mm2)	5.5(0.05)	4.2(0.05)	5.6(0.05)	6.2(0.05)	5.9(0.05)
特性	For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area

Recommended Work III	Glass Crystal
Part Number	UDT-1025MC	UDT-1325D	UDT-1915MC
基材	PET
顏色	T
總厚度 (μm)	125	155	203
黏著力 (μm)	25		15
Adhesive Strength (N/20mm)	30.0(0.2)	20.4(0.2)	20.3(0.2)
Probe Tack (N/20mm2)	7.5(0.05)	6.7(0.05)	5.9(0.05)
特性	For less backside cracking	For encapsulated workpiece	For less backside cracking

＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.

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TOYO UDV-100J芯片切割uv膜，新友維半導體切割uv膜

晶圓切割膠帶 - Pressure Sensitive Series -

晶圓切割膠帶 - UV Series -

TOYO UDV-100J芯片切割uv膜，新友維半導體切割uv膜